PCB
(Thursday, February 15th, 2007 by Yves Roumazeilles)
Posted in Electronic Process, PC, _EN, _FR
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eBOM
(Monday, September 11th, 2006 by Yves Roumazeilles)
Electronic Bill of Material.
Engineering Bill of Material.
Cf. BOM.
Posted in Electronic Process, Quality, _DE, _EN, _ES, _FR
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BGA
(Monday, September 11th, 2006 by Yves Roumazeilles)
Ball Grid Array.
A specific electronic component package characterised by the presence of a large number (an array) of small metallic balls used as electrical contact between the PCB and the component).
Un type particulier de package pour composant électronique caractérisé par la présence d’un grand nomber (une matrice – array) de petites billes métalliques destinées à assurer le contact électriques entre le PCB et le composant lui-même.
Posted in Electronic Process, PC, Semiconductor, _EN, _FR
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BCI
(Monday, September 11th, 2006 by Yves Roumazeilles)
Bulk Current Injection (EMC).
Posted in Electronic Process, Quality, _EN
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Assy
(Friday, September 8th, 2006 by Yves Roumazeilles)
Assembly (English).
Assemblage (Français).
Posted in Auto, Electronic Process, Semiconductor, Uncategorized, _EN, _FR
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D sample
(Friday, September 8th, 2006 by Yves Roumazeilles)
Cf. Sample levels.
Posted in Auto, Electronic Process, Quality, _DE, _EN, _ES, _FR
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C sample
(Friday, September 8th, 2006 by Yves Roumazeilles)
Cf. Sample levels.
Posted in Auto, Electronic Process, Quality, _DE, _EN, _ES, _FR
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B sample
(Friday, September 8th, 2006 by Yves Roumazeilles)
Cf. Sample levels.
Posted in Auto, Electronic Process, Quality, _DE, _EN, _ES, _FR
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A sample
(Friday, September 8th, 2006 by Yves Roumazeilles)
Cf. Sample levels.
Posted in Auto, Electronic Process, Quality, _DE, _EN, _ES, _FR
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API
(Friday, September 8th, 2006 by Yves Roumazeilles)
Automatic Paste Inspection (component soldering process for electronic boards).
Inspection automatique de la pâte à braser (process de soudure de composants sur carte électronique).
Posted in Electronic Process, Quality, _EN, _FR
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